mpxaz4100a rev 1, 05/2005 freescale semiconductor technical data ? freescale semiconductor, in c., 2005. all rights reserved. i ntegrated silicon pressure sensor for manifold absolute pressure applications on-chip signal conditioned, temperature compensated and calibrated the freescale mpxaz4100a series manifold absolute pressure (map) sensor for engine control is designed to sense absolute air pressure within the intake manifold. this measurement can be used to compute the amount of fuel required for each cylinder. the small form factor and high reliability of on-chip integration makes the freescale map sensor a logical and economical choice for automotive system designers. the mpxaz4100a series piezoresistive transducer is a state-of-the-art, monolithic, signal conditio ned, silicon pressure sensor. this sensor combines advanced micromachining techniques, th in film metallization, and bipolar semiconductor processing to provide an accu rate, high level analog output signal that is proportional to applied pressure. figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. features ? resistant to high humidity and common automotive media ? 1.8% maximum error over 0 to 85 c ? specifically designed for intake manifold absolute pressure sensing in engine control systems ? ideally suited for mi croprocessor or microcontroller based systems ? temperature compensated over ?40 c to +125 c ? durable thermoplastic ( pps) surface mount package typical applications ? manifold sensing for automotive systems ? also ideal for non-automotive applications ordering information device type options case no. mpx series order no. packing options device marking small outline package (mpxaz4100a series) basic elements absolute, element only 482 mpxaz4100a6u rails mpxaz4100a absolute, element only 482 mpxaz4100a6t1 tape & reel mpxaz4100a ported elements absolute, axial port 482a mpxaz4100ac6u rails mpxaz4100a absolute, axial port 482a MPXAZ4100AC6T1 tape & reel mpxaz4100a mpxaz4100a series integrated pressure sensor 20 to 105 kpa (2.9 to 15.2 psi) 0.3 to 4.9 v output mpxa4100a6u/6t1 case 482-01 mpxa4100ac6u/ac6t1 case 482a-01 pin number (1) 1. pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. 1 n/c 5 n/c 2 v s 6 n/c 3 gnd 7 n/c 4 v out 8 n/c small outline packages
sensors 2 freescale semiconductor mpxaz4100a figure 1. fully integrated pressure sensor schematic table 1. maximum ratings (1) 1. exposure beyond the specified limits may c ause permanent damage or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 400 kpa storage temperature t stg ?40 to +125 c operating temperature t a ?40 to +125 c v s v out gnd sensing element pins 1, 5, 6, 7, and 8 are no connects for small outline package devices. thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry
sensors freescale semiconductor 3 mpxaz4100a table 2. operating characteristics (v s = 5.1 vdc, t a = 25c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 3 required to meet elec trical specifications.) characteristic symbol min typ max unit pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 20 ? 105 kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. v s 4.85 5.1 5.35 vdc supply current i o ? 7.0 10 madc minimum pressure offset (0 to 85 c) @ v s = 5.1 volts (3) 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 0.225 0.306 0.388 vdc full scale output (0 to 85 c) @ v s = 5.1 volts (4) 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 4.870 4.951 5.032 vdc full scale span (0 to 85 c) @ v s = 5.1 volts (5) 5. full scale span (v fss ) is defined as the algebraic difference between the output vo ltage at full rated pressure and the output voltage at the minimum rated pressure. v fss ?4.59? vdc accuracy (6) (0 to 85 c) 6. accuracy (error budget) consists of the following: ? linearity: output deviation from a stra ight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature with in the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when th is pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pre ssure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? variation from nominal: the variation from nominal values , for offset or full scale span, as a percent of v fss , at 25 c. ??? 1.8 %v fss sensitivity v/p ? 54 ? mv/kpa response time (7) 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?ms output source current at full scale output i o+ ?0.1?madc warm-up time (8) 8. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. ??20?ms offset stability (9) 9. offset stability is the product's output deviation when subjected to 1000 hours of pu lsed pressure, temperature cycling with bias test. ?? 0.5 ? %v fss
sensors 4 freescale semiconductor mpxaz4100a figure 2 illustrates an absolute sensing chip in the basic chip carrier (case 482). figure 4 shows the sensor output signal relative to pressure input. typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85 c using the decoupling circuit shown in figure 3 . the output will saturate outside of the specified pressure range. a gel die coat isolates the di e surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. contact the factory for more information regarding media compatibility in your specific application. figure 3 shows the recommended decoupling circuit for interfacing the output of the in tegrated sensor to the a/d input of a microprocessor or microcontroller. proper decoupling of the power supply is recommended. figure 2. cross sectional diagram sop (not to scale) figure 3. recommended power supply decoupling and output filtering (for additional output filtering, please refer to application note an1646.) figure 4. output versus absolute pressure fluoro silicone gel die coat wire bond lead frame sealed vacuum reference absolute element die bond stainless steel cap thermoplastic case p1 die +5 v 1.0 f 0.01 f 470 pf gnd v s v out ips output output (volts) 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 max typ min 5.0 4.5 3.5 4.0 3.0 2.5 2.0 1.5 1.0 0 0.5 pressure (ref: to sealed vacuum) in kpa transfer function: v out = v s * (.01059*p-.152) error v s = 5.1 vdc temperature = 0 to 85c 20 kpa to 105 kpa mpxaz4100a
sensors freescale semiconductor 5 mpxaz4100a nominal transfer value: v out = v s (p x 0.01059 - 0.1518) (pressure error x temp. factor x 0.01059 x v s ) v s = 5.1 v 0.25 vdc transfer function (mpxaz4100a) mpxaz4100a series temp multiplier -40 3 0 to 85 1 +125 3 temperature in c 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 140 120 100 80 temperature error factor note: the temperature multiplier is a linear response from 0c to-40c and from 85c to 125c. temperature error band error limits for pressure 3.0 2.0 1.0 -1.0 -2.0 -3.0 0.0 20 40 60 80 100 120 pressure (in kpa) pressure error (kpa) pressure error (max) pressure error band 20 to 105 (kpa) 1.5 (kpa)
sensors 6 freescale semiconductor mpxaz4100a information for using the small outline package (case 482) minimum recommended footprint fo r surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the su rface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. with the correct footprint, the packages will se lf align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. figure 5. sop footprint (case 482) 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 8x 2.54 0.300 7.62 inch mm scale 2:1
sensors freescale semiconductor 7 mpxaz4100a package dimensions case 482-01 issue o small outline package s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a s t -a- -b- n c m j k pin 1 identifier h seating plane -t- dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 5.38 0.230 0.212 5.84 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.405 0.415 10.29 10.54 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. pin 1 identifier h seating plane -t- w c m j k v dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a t -a- -b- n s case 482a-01 issue a small outline package
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